2009Nano Letters 9 91–96

Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale Solder

Yong Peng, Tony Cullis, Beverley Inkson

Highlight

With a low-melting nanosolder acting as glue, a Sheffield group welded individual metal nano-objects into free-standing structures, assembling them one piece at a time in the SEM.

The authors demonstrate bottom-up nanoconstruction by welding individual metallic nano-objects with a low-melting-point nanoscale solder, manipulated and joined with an MM3A-EM inside the SEM. The approach assembles free-standing nanostructures one component at a time, the solder forming electrical and mechanical joints between dissimilar nano-objects.

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