The in-situ lift-out workflow

Approach, attach, cut free, transfer and mount, the choreography of a clean FIB lift-out.

A successful lift-out is a short, exacting sequence. Each step has to be repeatable, because a busy lab runs it many times a day.

  1. Approach. Drive the probe to the milled lamella. Spherical, backlash-free motion with sub-nanometre resolution lets you close the last micrometres without overshoot.
  2. Attach. Bond the probe to the lamella, by ion-beam redeposition or, weld-free, with SemGlu vacuum-safe adhesive to avoid contaminating the contact.
  3. Cut free. Mill the final tab so the lamella releases cleanly onto the probe.
  4. Transfer. Carry the lamella to the TEM grid. Encoded systems recall the grid position exactly, so the move is the same every time.
  5. Mount & thin. Fix the lamella to the post and finish-thin to electron transparency.

Why closed-loop helps#

With the encoded MM3E you can define the parking, lamella and grid positions once and recall them at the click of a button, giving placement reproducibility better than 2 µm, the difference between a hand-tuned art and a repeatable, high-yield process.

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